Texas A&M University
A competitive summer REU for engineering and science majors at 4-year U.S. universities who have completed their second or third year with a 3.0 GPA or better, with projects in neuromorphic materials, low-dimensional devices, electronics packaging and thermal management. Students receive a $6,000 stipend, on-campus housing, up to $500 travel support and a visit to a semiconductor fab; application review begins January 15.